Title :
Scheduling Analysis of Cluster Tools with Buffer/Process Modules
Author :
Yi, Jingang ; Ding, Shengwei ; Song, Dezhen ; Zhang, Mike Tao
Author_Institution :
Dept. of Mech. Eng., San Diego State Univ., CA
Abstract :
Modeling and scheduling of cluster tools are critical to improving the productivity and to enhancing the design of wafer processing flows and equipment for semiconductor manufacturing. In this paper, we extend the decomposition methods in the work of Dwande et al. (2005) for multi-cluster tools with buffer/process modules (BPMs). The computation of the lower-bound cycle time (fundamental period) is presented. Optimality conditions and robot schedules that realize such lower-bound values are then provided using "pull" and "swap" strategies for single-blade and double-blade robots, respectively. The impact of BPMs on throughput and robot schedules is studied. It is found that such an impact depends on the BPM processing time and the cycle times of the decomposed clusters on both sides of BPMs. A chemical vapor deposition (CVD) tool is used as an example of multi-cluster tools to illustrate the proposed method, analysis, and algorithms. The numerical and experimental results demonstrate the effectiveness and efficiency of the algorithms.
Keywords :
cluster tools; electronics industry; production equipment; scheduling; semiconductor device manufacture; CVD tool; buffer-process modules; chemical vapor deposition; cluster tool modeling; cluster tool scheduling; cluster tools; lower-bound cycle time; optimality conditions; robot schedules; semiconductor manufacturing; wafer processing flows; Clustering algorithms; Job shop scheduling; Manufacturing processes; Process design; Processor scheduling; Productivity; Robots; Semiconductor device manufacture; Semiconductor device modeling; Virtual manufacturing;
Conference_Titel :
Robotics and Automation, 2007 IEEE International Conference on
Conference_Location :
Roma
Print_ISBN :
1-4244-0601-3
Electronic_ISBN :
1050-4729
DOI :
10.1109/ROBOT.2007.363113