Title :
Wafer-level chip-scale packaging for low-end RF products
Author :
Bartek, M. ; Zilber, G. ; Teomin, D. ; Polyakov, A. ; Sinaga, S. ; Mendes, P.M. ; Burghartz, J.N.
Author_Institution :
Delft Univ. of Technol., Netherlands
Abstract :
The paper gives a short overview of wafer-level chip-scale packaging technology and analyses its added value in the packaging of RF ICs. Particularly, the possibilities of substrate crosstalk suppression by substrate thinning and trenching together with embedding of RF passives (inductors, antennas) are addressed. The Shellcase-type wafer-level packaging solution is used as a study case presenting its fabrication aspects and its potential for RF IC packaging.
Keywords :
antennas; chip scale packaging; crosstalk; inductors; interference suppression; radiofrequency integrated circuits; substrates; RF IC packaging; RF passives; RFIC packaging; Shellcase packaging; antennas; inductors; low-end RF products; substrate crosstalk suppression; substrate thinning; substrate trenching; wafer-level chip-scale packaging; CMOS image sensors; Chip scale packaging; Electronics packaging; Glass; Integrated circuit packaging; Isolation technology; Manufacturing; Radio frequency; Silicon; Wafer scale integration;
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems, 2004. Digest of Papers. 2004 Topical Meeting on
Print_ISBN :
0-7803-8703-1
DOI :
10.1109/SMIC.2004.1398162
