DocumentCode :
2622907
Title :
Radiated emissions from printed circuit board traces including the effect of vias, as a function of source, termination and board characteristics
Author :
Kaires, Robert G.
Author_Institution :
Tektronix Inc., Beaverton, OR, USA
Volume :
2
fYear :
1998
fDate :
24-28 Aug 1998
Firstpage :
872
Abstract :
The radiation from a printed circuit board (PCB) trace (microstrip) is analyzed including end effects. The end effects are due to the “vias” which connect the trace to the circuit board ground. The PCB trace currents are calculated from closed-form transmission line equations which includes dielectric effects of the board. The board ground plane is assumed to be infinite. Electric field magnitudes are then found from these currents using a free space Green´s function ignoring the board dielectric. This is compared with full-wave method of moments (MoM) analysis for finite size ground planes. The effect of ground plane size variations is noted. The worst case electric field magnitude is calculated from 50 to 2000 MHz at numerous points on a sphere with a 3-meter radius. The via radiation is isolated from the PCB trace radiation to observe the relative magnitudes. The motivation for this work is twofold. We wish to quantify the magnitude of radiation, which occurs from differential mode currents flowing through horizontal components such as PCB traces and vertical components such as vias, and package leads. Also, we wish to see how this radiation is affected by source, termination and board characteristics
Keywords :
Green´s function methods; electric fields; electromagnetic interference; method of moments; microstrip lines; printed circuits; transmission line theory; 3 m; 50 to 2000 MHz; PCB microstrip; board ground plane; circuit board ground; closed-form transmission line equations; dielectric effects; differential mode currents; electric field magnitudes; finite size ground planes; free space Green´s function; full-wave method of moments analysis; ground plane size variations; horizontal components; printed circuit board traces; radiated emissions; trace currents; vertical components; vias effect; worst case electric field magnitude; Dielectrics; Distributed parameter circuits; Impedance; Message-oriented middleware; Microstrip; Packaging; Power transmission lines; Predictive models; Printed circuits; Transmission line theory;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 1998. 1998 IEEE International Symposium on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-5015-4
Type :
conf
DOI :
10.1109/ISEMC.1998.750322
Filename :
750322
Link To Document :
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