Measurement and 3D simulations of substrate noise isolation and resistance for mixed signal applications

Author

Rajendran, K. ; Johnson, J.B. ; Furkay, S. ; Kumar, M. ; Fischer, S.

Author_Institution

IBM Syst. & Technol. Group, Essex Junction, VT, USA

fYear

2004

fDate

8-10 Sept. 2004

Firstpage

99

Lastpage

102

Abstract

In this work an enhanced approach to 3D process modeling using mixed element meshes followed by tetrahedralization and small signal device simulation by Fielday is presented. This methodology is then used to analyze and predict the effects of various substrate isolation schemes on substrate noise coupling. Experimental results are used to calibrate and verify the simulation results. Our proposed various substrate isolation test structure results reveal that layout guidelines and isolation parameter analysis are useful in signal isolation optimization.

Keywords

circuit optimisation; circuit simulation; electric noise measurement; electric resistance measurement; integrated circuit layout; isolation technology; mixed analogue-digital integrated circuits; substrates; 3D process modeling; 3D simulations; Fielday; isolation parameter analysis; layout guidelines; mixed element meshes; mixed signal applications; resistance measurement; signal isolation optimization; small signal device simulation; substrate noise coupling; substrate noise isolation; tetrahedralization; Circuit noise; Circuit simulation; Coupling circuits; Digital circuits; Electrical resistance measurement; Isolation technology; Noise measurement; Radio frequency; Signal processing; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Silicon Monolithic Integrated Circuits in RF Systems, 2004. Digest of Papers. 2004 Topical Meeting on

Print_ISBN

0-7803-8703-1

Type

conf

DOI

10.1109/SMIC.2004.1398177

Filename

1398177