• DocumentCode
    262323
  • Title

    17.6 Envelope modulator for multimode transmitters with AC-coupled multilevel regulators

  • Author

    Arno, Patrik ; Thomas, Martyn ; Molata, Vladimir ; Jerabek, Tomas

  • Author_Institution
    STMicroelectron., Grenoble, France
  • fYear
    2014
  • fDate
    9-13 Feb. 2014
  • Firstpage
    296
  • Lastpage
    297
  • Abstract
    Modern wireless communication systems, such as high-speed uplink packet access (HSUPA) or long term evolution (LTE), employ highly spectral-efficient modulations with inherent non-constant envelope signals having high peak-to-average power ratio (PAPR). These signals require the RF Power Amplifiers (PAs) to be backed off from saturation to satisfy the stringent linearity requirements. Unfortunately, linear operation leads to very low overall system efficiency. The envelope tracking (ET) technique has been identified as one possible solution to improve the global efficiency of the RF transmission chain. This technique has raised interest in the optimization of the fast supply envelope modulator (EM), the most critical component in the system. Several topologies for the EM exist such as fast buck converters, multilevel buck converters [1] and parallel hybrid structures with a class-AB amplifier AC-coupled to a buck converter [2].
  • Keywords
    modulators; power convertors; radio transmitters; radiofrequency power amplifiers; AC-coupled multilevel regulators; ET technique; HSUPA; LTE; PAPR; RF PA; RF power amplifiers; RF transmission chain; class-AB amplifier; envelope tracking technique; fast buck converters; fast supply envelope modulator; high-speed uplink packet access; inherent nonconstant envelope signals; linear operation; long term evolution; modern wireless communication systems; multilevel buck converters; multimode transmitters; parallel hybrid structures; peak-to-average power ratio; spectral-efficient modulations; Power amplifiers; Pulse width modulation; Radio frequency; Regulators; Switches; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4799-0918-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2014.6757441
  • Filename
    6757441