DocumentCode :
262323
Title :
17.6 Envelope modulator for multimode transmitters with AC-coupled multilevel regulators
Author :
Arno, Patrik ; Thomas, Martyn ; Molata, Vladimir ; Jerabek, Tomas
Author_Institution :
STMicroelectron., Grenoble, France
fYear :
2014
fDate :
9-13 Feb. 2014
Firstpage :
296
Lastpage :
297
Abstract :
Modern wireless communication systems, such as high-speed uplink packet access (HSUPA) or long term evolution (LTE), employ highly spectral-efficient modulations with inherent non-constant envelope signals having high peak-to-average power ratio (PAPR). These signals require the RF Power Amplifiers (PAs) to be backed off from saturation to satisfy the stringent linearity requirements. Unfortunately, linear operation leads to very low overall system efficiency. The envelope tracking (ET) technique has been identified as one possible solution to improve the global efficiency of the RF transmission chain. This technique has raised interest in the optimization of the fast supply envelope modulator (EM), the most critical component in the system. Several topologies for the EM exist such as fast buck converters, multilevel buck converters [1] and parallel hybrid structures with a class-AB amplifier AC-coupled to a buck converter [2].
Keywords :
modulators; power convertors; radio transmitters; radiofrequency power amplifiers; AC-coupled multilevel regulators; ET technique; HSUPA; LTE; PAPR; RF PA; RF power amplifiers; RF transmission chain; class-AB amplifier; envelope tracking technique; fast buck converters; fast supply envelope modulator; high-speed uplink packet access; inherent nonconstant envelope signals; linear operation; long term evolution; modern wireless communication systems; multilevel buck converters; multimode transmitters; parallel hybrid structures; peak-to-average power ratio; spectral-efficient modulations; Power amplifiers; Pulse width modulation; Radio frequency; Regulators; Switches; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
978-1-4799-0918-6
Type :
conf
DOI :
10.1109/ISSCC.2014.6757441
Filename :
6757441
Link To Document :
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