DocumentCode
262323
Title
17.6 Envelope modulator for multimode transmitters with AC-coupled multilevel regulators
Author
Arno, Patrik ; Thomas, Martyn ; Molata, Vladimir ; Jerabek, Tomas
Author_Institution
STMicroelectron., Grenoble, France
fYear
2014
fDate
9-13 Feb. 2014
Firstpage
296
Lastpage
297
Abstract
Modern wireless communication systems, such as high-speed uplink packet access (HSUPA) or long term evolution (LTE), employ highly spectral-efficient modulations with inherent non-constant envelope signals having high peak-to-average power ratio (PAPR). These signals require the RF Power Amplifiers (PAs) to be backed off from saturation to satisfy the stringent linearity requirements. Unfortunately, linear operation leads to very low overall system efficiency. The envelope tracking (ET) technique has been identified as one possible solution to improve the global efficiency of the RF transmission chain. This technique has raised interest in the optimization of the fast supply envelope modulator (EM), the most critical component in the system. Several topologies for the EM exist such as fast buck converters, multilevel buck converters [1] and parallel hybrid structures with a class-AB amplifier AC-coupled to a buck converter [2].
Keywords
modulators; power convertors; radio transmitters; radiofrequency power amplifiers; AC-coupled multilevel regulators; ET technique; HSUPA; LTE; PAPR; RF PA; RF power amplifiers; RF transmission chain; class-AB amplifier; envelope tracking technique; fast buck converters; fast supply envelope modulator; high-speed uplink packet access; inherent nonconstant envelope signals; linear operation; long term evolution; modern wireless communication systems; multilevel buck converters; multimode transmitters; parallel hybrid structures; peak-to-average power ratio; spectral-efficient modulations; Power amplifiers; Pulse width modulation; Radio frequency; Regulators; Switches; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
Conference_Location
San Francisco, CA
ISSN
0193-6530
Print_ISBN
978-1-4799-0918-6
Type
conf
DOI
10.1109/ISSCC.2014.6757441
Filename
6757441
Link To Document