Automatic Functional Stress Pattern Generation for SoC Reliability Characterization

Reliability testing is increasingly used not only to reduce Infant Mortality effects, but also for Reliability Characterization. This paper first discusses the characteristics of the stimuli to be used during Reliability Characterization experiments, and outlines the importance of adopting a functional approach. Secondly, the paper describes a novel approach to automatically generate suitable stress patterns to be used during the Reliability characterization process of Systems-on-chip. The generation process uses an evolutionary algorithm driven by suitable state toggling-related metrics purposely defined in the paper. Costs and benefits of the proposed approach are highlighted, supported by the results gathered on a test vehicle released on a 90 nm technology.