• DocumentCode
    2623381
  • Title

    A distributed power supply system using new heat dissipation techniques

  • Author

    Chida, Jun ; Ohara, Hichimasa ; Satoh, Mitsuo ; Usui, Yoshinori

  • Author_Institution
    Fujitsu Ltd., Kawasaki, Japan
  • fYear
    1989
  • fDate
    15-18 Oct 1989
  • Abstract
    The authors describe a distributed power supply system for communication equipment. The system features a novel heat dissipation technique which uses a heat pipe and coupler. By adapting this system to a communications equipment system with four heat equipment subsystems which requires a total power of 400 W, it is possible to systematically reduce the power supply cost to about half of that of a conventional independent power supply system. The output power density in a shelf is five times that of the conventional power supply with heat sink,
  • Keywords
    cooling; power supplies to apparatus; telecommunication equipment; communication equipment; coupler; distributed power supply system; heat dissipation; heat pipe; output power density; Capacitors; Cooling; Costs; Heat sinks; Power conversion; Power generation; Power supplies; Power system reliability; Switching frequency; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Telecommunications Energy Conference, 1989. INTELEC '89. Conference Proceedings., Eleventh International
  • Conference_Location
    Florence
  • Type

    conf

  • DOI
    10.1109/INTLEC.1989.88359
  • Filename
    88359