Title :
Analysis of fault transients and breakdown conditions in laminated printed circuit card structures
Author :
Jorgenson, Joel A. ; Vakil, Sadegh
Author_Institution :
Dept. of Electr. Eng., North Dakota Univ., Grand Forks, ND, USA
Abstract :
In certain embedded applications operating in harsh environments severe overvoltage conditions produced by external transients can occur. The advent and incorporation of advanced interconnect technologies and geometries worsen the problem, to the point of invalidating certain assumptions critical to system survival. The purpose of this research is to determine the limits of operation, and to develop a means for analysis and prediction of reliable operation
Keywords :
electric breakdown; fault diagnosis; overvoltage; printed circuits; transient analysis; advanced interconnect technologies; breakdown conditions; external transients; fault transients analysis; harsh environments; laminated printed circuit card structures; overvoltage conditions; Circuit faults; Circuit testing; Dielectrics; Electric breakdown; Electronic packaging thermal management; Electronics packaging; Geometry; Integrated circuit interconnections; Printed circuits; Transient analysis;
Conference_Titel :
Electromagnetic Compatibility, 1998. 1998 IEEE International Symposium on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-5015-4
DOI :
10.1109/ISEMC.1998.750349
