DocumentCode :
2623410
Title :
Recent developments in porous silicon substrates for RF/microwave applications
Author :
Drayton, Rhonda Franklin
Author_Institution :
Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
fYear :
2004
fDate :
8-10 Sept. 2004
Firstpage :
155
Lastpage :
158
Abstract :
Highly integrated system design is sought in silicon (Si) substrates due to the potential cost savings from volume manufacturing. For GHz applications, two research efforts in silicon have evolved, BiCMOS in SiGe and CMOS in Si, utilizing high and low resistivity silicon materials, respectively. In order to integrate active and passive designs in CMOS grade substrates with conductive and insulating features, multilayer and substrate modification methods have been investigated. The paper presents an overview of one substrate modification method, porous silicon, and recent electrical characterization data of GHz interconnect performance on dielectric capped and oxide converted forms of the material. In addition, highlights are presented of several RF circuit demonstrations on lumped element, active circuit, and packaging performance.
Keywords :
BiCMOS integrated circuits; CMOS integrated circuits; electrical resistivity; integrated circuit interconnections; microwave integrated circuits; porous semiconductors; radiofrequency integrated circuits; silicon; substrates; BiCMOS; CMOS; RF applications; Si; SiGe; active circuit; conductive features; insulating features; integrated system design; interconnect electrical characterization data; lumped element; microwave applications; multilayer methods; oxide capped porous silicon; packaging; porous silicon substrates; resistivity; silicon-germanium; substrate modification methods; BiCMOS integrated circuits; Conducting materials; Conductivity; Costs; Dielectric materials; Dielectric substrates; Germanium silicon alloys; Manufacturing; Radio frequency; Silicon germanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems, 2004. Digest of Papers. 2004 Topical Meeting on
Print_ISBN :
0-7803-8703-1
Type :
conf
DOI :
10.1109/SMIC.2004.1398191
Filename :
1398191
Link To Document :
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