DocumentCode :
262441
Title :
22.6 A 2.2GS/s 7b 27.4mW time-based folding-flash ADC with resistively averaged voltage-to-time amplifiers
Author :
Miyahara, Masaya ; Mano, Ibuki ; Nakayama, Makoto ; Okada, Kenichi ; Matsuzawa, Akira
Author_Institution :
Tokyo Inst. of Technol., Tokyo, Japan
fYear :
2014
fDate :
9-13 Feb. 2014
Firstpage :
388
Lastpage :
389
Abstract :
High-speed low-resolution ADCs are widely used for various applications, such as 60GHz receivers, serial links, and high-density disk drive systems. Flash architectures have the highest conversion rate without employing time interleaving. Moreover, flash architectures have the lowest latency, which is often required in feedback-loop systems. However, the area and power consumption are exponentially increased by increasing the resolution since the number of comparators must be 2N. A folding architecture is a well-known technique to reduce the number of comparators in an ADC while maintaining high sampling rate and low latency [1,2]. Folding architectures were previously realized by generating a number of zero crossings with folding amplifiers. However, the conventional folding amplifiers consume a large amount of power to realize a fast response. In contrast, a folding ADC with only dynamic power consumption and without using amplifiers is reported in [3]. However, only a folding factor of 2 is realized, and therefore the number of comparators is reduced by half.
Keywords :
amplifiers; analogue-digital conversion; circuit feedback; comparators (circuits); low-power electronics; comparators; dynamic power consumption; feedback-loop systems; flash architectures; folding amplifiers; folding architecture; frequency 60 GHz; high sampling rate; high-density disk drive systems; high-speed low-resolution ADCs; power 27.4 mW; receivers; resistively averaged voltage-to-time amplifiers; serial links; time-based folding-flash ADC architecture; word length 7 bit; zero crossing number; CMOS integrated circuits; Calibration; Delays; Interpolation; Latches; Power demand; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
978-1-4799-0918-6
Type :
conf
DOI :
10.1109/ISSCC.2014.6757482
Filename :
6757482
Link To Document :
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