DocumentCode
2624624
Title
Impact of Polarity and Hf concentration on Breakdown of HfSiON/SiO2 Gate Dielectrics
Author
Sato, Motoyuki ; Hirano, Izumi ; Aoyama, Tomonori ; Sekine, Katsuyuki ; Kobayashi, Takuya ; Yamaguchi, Takeshi ; Eguchi, Kazuhiro ; Tsunashima, Yoshitaka
Author_Institution
Semicond. Co., Toshiba Corp., Yokohama
fYear
0
fDate
0-0 0
Firstpage
28
Lastpage
29
Abstract
We have investigated the impact of polarity and Hf concentration on HfSiON/SiO2 gate dielectrics breakdown with TZDB and TDDB. In TZDB, gate leakage currents at breakdown in negative bias are much smaller than those in positive bias without regard to accumulation or inversion states. Since electric fields at breakdown are not all the same, the breakdown mechanism cannot be explained with a simple thermochemical model. In TDDB, thermochemical breakdown of HfSiON itself is adequate for nMOS in inversion. On the other hand, breakdown of pMOS in inversion is affected by the carrier currents. The breakdown mechanisms are strongly dependent on the polarity and Hf concentration
Keywords
MOSFET; hafnium compounds; leakage currents; semiconductor device breakdown; semiconductor device reliability; silicon compounds; HfSiON-SiO2; TDDB; TZDB; dielectric breakdown; gate dielectrics; gate leakage currents; polarity impact; thermochemical breakdown; CMOSFETs; Dielectric breakdown; Dielectric constant; Dielectric measurements; Electric breakdown; Epitaxial growth; Hafnium; High K dielectric materials; Leakage current; MOS devices;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 2006. Digest of Technical Papers. 2006 Symposium on
Conference_Location
Honolulu, HI
Print_ISBN
1-4244-0005-8
Type
conf
DOI
10.1109/VLSIT.2006.1705200
Filename
1705200
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