• DocumentCode
    2624624
  • Title

    Impact of Polarity and Hf concentration on Breakdown of HfSiON/SiO2 Gate Dielectrics

  • Author

    Sato, Motoyuki ; Hirano, Izumi ; Aoyama, Tomonori ; Sekine, Katsuyuki ; Kobayashi, Takuya ; Yamaguchi, Takeshi ; Eguchi, Kazuhiro ; Tsunashima, Yoshitaka

  • Author_Institution
    Semicond. Co., Toshiba Corp., Yokohama
  • fYear
    0
  • fDate
    0-0 0
  • Firstpage
    28
  • Lastpage
    29
  • Abstract
    We have investigated the impact of polarity and Hf concentration on HfSiON/SiO2 gate dielectrics breakdown with TZDB and TDDB. In TZDB, gate leakage currents at breakdown in negative bias are much smaller than those in positive bias without regard to accumulation or inversion states. Since electric fields at breakdown are not all the same, the breakdown mechanism cannot be explained with a simple thermochemical model. In TDDB, thermochemical breakdown of HfSiON itself is adequate for nMOS in inversion. On the other hand, breakdown of pMOS in inversion is affected by the carrier currents. The breakdown mechanisms are strongly dependent on the polarity and Hf concentration
  • Keywords
    MOSFET; hafnium compounds; leakage currents; semiconductor device breakdown; semiconductor device reliability; silicon compounds; HfSiON-SiO2; TDDB; TZDB; dielectric breakdown; gate dielectrics; gate leakage currents; polarity impact; thermochemical breakdown; CMOSFETs; Dielectric breakdown; Dielectric constant; Dielectric measurements; Electric breakdown; Epitaxial growth; Hafnium; High K dielectric materials; Leakage current; MOS devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 2006. Digest of Technical Papers. 2006 Symposium on
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    1-4244-0005-8
  • Type

    conf

  • DOI
    10.1109/VLSIT.2006.1705200
  • Filename
    1705200