DocumentCode :
2625094
Title :
122 Mb High Speed SRAM Cell with 25 nm Gate Length Multi-Bridge-Channel MOSFET (MBCFET) on Bulk Si Substrate
Author :
Kim, Min Sang ; Lee, Sung-Young ; Yoon, Eun-Jung ; Kim, Sung Min ; Lian, Jun ; Lee, Kwan-heum ; Cho, Nam Myeon ; Lee, Mong-sub ; Hwang, Duhyun ; Lee, Yong-Seok ; Kim, Dong-Won ; Park, Donggun ; Ryu, Byung-Il
Author_Institution :
Semicond. R&D Center, Samsung Electron. Co., Yongin
fYear :
0
fDate :
0-0 0
Firstpage :
68
Lastpage :
69
Abstract :
As a part of continued multi-bridge-channel MOSFET (MBCFET) study, we have successfully fabricated 122Mb SRAM cell with 25 nm gate length CMOS MBCFET on bulk Si wafers. The 6-T MBCFET SRAM cell shows high static noise margin (SNM) of 320 mV at Vcc= 0.8 V. Using tall-embedded-gate (TEG) and source/drain (S/D) engineering, 2.6times105 times on/off current ratio and 3.46 mA/mum of on-state current at 13 nA/um of off-state current were achieved. In addition, triple-bridge-channel MOSFET (TBCFET) is made for the first time and compared with single-bridge-channel MOSFET (SBCFET) and MBCFET
Keywords :
CMOS integrated circuits; MOSFET; SRAM chips; semiconductor device reliability; 0.8 V; 122 MByte; 25 nm; 320 mV; SRAM cell; multibridge channel MOSFET; single bridge channel MOSFET; source/drain engineering; tall embedded gate engineering; triple bridge channel MOSFET; CMOS process; Capacitance; Doping; Etching; Fabrication; Germanium silicon alloys; MOSFET circuits; Random access memory; Silicon germanium; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 2006. Digest of Technical Papers. 2006 Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
1-4244-0005-8
Type :
conf
DOI :
10.1109/VLSIT.2006.1705220
Filename :
1705220
Link To Document :
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