Title :
27.7 A scalable 1.5-to-6Gb/s 6.2-to-38.1mW LDPC decoder for 60GHz wireless networks in 28nm UTBB FDSOI
Author :
Weiner, M. ; Blagojevic, Marjan ; Skotnikov, Sergey ; Burg, Andreas ; Flatresse, Philippe ; Nikolic, B.
Author_Institution :
Univ. of California, Berkeley, Berkeley, CA, USA
Abstract :
Low-density parity-check (LDPC) codes in modern wireless communications are rate- and throughput-scalable, and despite their complexity, decoding them requires low power consumption. The IEEE 802.11ad standard for Gb/s wireless LANs in the 60GHz band requires an implementation of an LDPC encoder/decoder with throughputs of 1.5, 3, and 6Gb/s, with code rates of 1/2, 5/8, 3/4 and 13/16. Previous implementations of decoders for these throughputs and levels of reconfiguration have power consumptions on the order of the rest of the baseband processing. This paper presents a fully compatible IEEE 802.11ad LDPC decoder in 28 nm ultra-thin body and BOX fully-depleted SOI (UTBB FDSOI) technology with a power consumption that is a small fraction of the total baseband power. To achieve this, the decoder introduces an approximate marginalization technique and a simplified reconfiguration method. Forward body biasing of FDSOI technology allows for minimum energy consumption across all decoding modes.
Keywords :
buried layers; codecs; field effect MIMIC; low-power electronics; parity check codes; silicon-on-insulator; wireless LAN; BOX fully depleted SOI technology; IEEE 802.11ad standard; LDPC decoder; LDPC encoder; UTBB FDSOI; approximate marginalization technique; forward body biasing; frequency 60 GHz; low density parity check codes; minimum energy consumption; power 6.2 mW to 38.1 mW; reconfiguration method; size 28 nm; ultrathin body SOI technology; wireless networks; Bit error rate; Decoding; Parity check codes; Pipeline processing; Power demand; Solid state circuits; Throughput;
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4799-0918-6
DOI :
10.1109/ISSCC.2014.6757515