DocumentCode
2625604
Title
Research on Numerical Simulation for Automotive Panel Forming and Spring-back Based on Dynaform
Author
Lei, Duan ; Dehua, Miao ; Yujun, Cai ; Zhoude, Qu ; Zhen, Li
Author_Institution
Tianjin Univ. of Technol. & Educ., Tianjin, China
Volume
3
fYear
2011
fDate
6-7 Jan. 2011
Firstpage
55
Lastpage
58
Abstract
The spring-back in automotive panel forming is one of the main problems, and the measure of controlling spring-back needs to predict the spring-back mount accurately. Taking the simulation method of the sheet stamping forming and spring-back as foundation, the simulation of stamping forming and spring-back for roof of automotive is carried out in Dynaform, and the result of simulation also is analyzed. The result shows that no crackle and wrinkle happen during the course of sheet metal forming, there are some regions sinking on the panel, other rising, and sinking tendency greater than rising. In order to control the spring-back, the inverted compensation method is adopted to optimization design die surface according the result of simulation. The rationality of spring-back controlling measure and the veracity of die surface modified are proved by the actual panel and detection result. The qualified product is obtained.
Keywords
automobile manufacture; automotive components; finite element analysis; metal stamping; plastic deformation; production engineering computing; sheet metal processing; structural panels; Dynaform software; automotive panel forming; die surface modification; finite element analysis; inverted compensation method; sheet stamping forming; springback control; wrinkling; Automotive engineering; Finite element methods; Metals; Numerical models; Numerical simulation; Strain; Surface treatment; Automotive Panel; Dynaform; Numerical Simulation; Spring-back; Stamping;
fLanguage
English
Publisher
ieee
Conference_Titel
Measuring Technology and Mechatronics Automation (ICMTMA), 2011 Third International Conference on
Conference_Location
Shangshai
Print_ISBN
978-1-4244-9010-3
Type
conf
DOI
10.1109/ICMTMA.2011.585
Filename
5721422
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