Heat transfer in a microchannel flow [substrate cooling]

Author

Chu, W.K.H. ; Hsu, C.T. ; Wong, M. ; Zohar, Y.

Author_Institution

Hong Kong Univ., Hong Kong

fYear

1994

fDate

34533

Firstpage

38

Lastpage

43

Abstract

The field of MicroElectroMechanical Systems (MEMS) is expanding rapidly. It is becoming feasible to integrate complete microsystems by merging mechanical, electrical, thermal, optical and perhaps chemical components. Utilizing surface micromachining techniques, a large number of small-size, high-precision channels can be constructed as part of microcooling systems. The experimental setup proposed for the study of heat transfer characteristics of such microchannel flow is described in the first part of the paper. In the second part, initial results of a theoretical investigation of heat removal from a substrate by microchannel flow are presented

Keywords

channel flow; cooling; integrated circuit packaging; micromechanical devices; substrates; heat transfer characteristics; microchannel flow; microcooling systems; microelectromechanical systems; substrate heat removal; surface micromachining techniques; Chemicals; Cooling; Heat transfer; Integrated optics; Merging; Microchannel; Microelectromechanical systems; Micromachining; Micromechanical devices; Optical devices;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting, 1994.Proceedings., 1994 IEEE Hong Kong

Print_ISBN

0-7803-2086-7

Type

conf

DOI

10.1109/HKEDM.1994.395134

Filename

395134