Title :
Heat transfer in a microchannel flow [substrate cooling]
Author :
Chu, W.K.H. ; Hsu, C.T. ; Wong, M. ; Zohar, Y.
Author_Institution :
Hong Kong Univ., Hong Kong
Abstract :
The field of MicroElectroMechanical Systems (MEMS) is expanding rapidly. It is becoming feasible to integrate complete microsystems by merging mechanical, electrical, thermal, optical and perhaps chemical components. Utilizing surface micromachining techniques, a large number of small-size, high-precision channels can be constructed as part of microcooling systems. The experimental setup proposed for the study of heat transfer characteristics of such microchannel flow is described in the first part of the paper. In the second part, initial results of a theoretical investigation of heat removal from a substrate by microchannel flow are presented
Keywords :
channel flow; cooling; integrated circuit packaging; micromechanical devices; substrates; heat transfer characteristics; microchannel flow; microcooling systems; microelectromechanical systems; substrate heat removal; surface micromachining techniques; Chemicals; Cooling; Heat transfer; Integrated optics; Merging; Microchannel; Microelectromechanical systems; Micromachining; Micromechanical devices; Optical devices;
Conference_Titel :
Electron Devices Meeting, 1994.Proceedings., 1994 IEEE Hong Kong
Print_ISBN :
0-7803-2086-7
DOI :
10.1109/HKEDM.1994.395134
