Title :
A Novel Cu Electrical Fuse Structure and Blowing Scheme Utilizing Crack-Assisted Mode for 90-45nm-Node and Beyond
Author :
Ueda, T. ; Takaoka, H. ; Hamada, M. ; Kobayashi, Y. ; Ono, A.
Author_Institution :
Adv. Device Dev. Div., NEC Electron. Corp., Kanagawa
Abstract :
This paper presents the redundancy technology that uses Cu wiring as electrical fuse (e-fuse) for the first time. The novel e-fuse employs "crack-assisted mode" to blow fuse-material (Cu wire). Because Cu wiring is used instead of gate poly electrode material, the technology is extendible from the present 90nm~65nm technology-node to a few generations beyond 45nm-node, where Cu wiring is still likely to be employed. This e-fuse technology achieves very high reliability of less than 0.001ppm defective rate. High stability of this new e-fuse has been proven with actual 90nm generation products
Keywords :
copper; cracks; electric fuses; nanotechnology; redundancy; wiring; 45 to 90 nm; Cu; blowing scheme; crack-assisted mode; e-fuse technology; electrical fuse; fuse material; redundancy technology; Design for manufacture; Electrodes; Fuses; National electric code; Redundancy; Stability; Testing; Voltage; Wire; Wiring;
Conference_Titel :
VLSI Technology, 2006. Digest of Technical Papers. 2006 Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
1-4244-0005-8
DOI :
10.1109/VLSIT.2006.1705255
