DocumentCode
26260
Title
Surface Tension-Driven Self-Alignment of Microchips on Low-Precision Receptors
Author
Routa, Iiris ; Bo Chang ; Shah, Aamer ; Quan Zhou
Author_Institution
Dept. of Autom. & Syst. Technol., Aalto Univ., Aalto, Finland
Volume
23
Issue
4
fYear
2014
fDate
Aug. 2014
Firstpage
819
Lastpage
828
Abstract
Surface tension-driven self-alignment is reported to be very accurate when the chip and receptor site are well-defined. This paper investigates surface tension-driven self-alignment of microchips on low-precision receptors through experimental studies and theoretical analysis to understand the relation between alignment accuracy and the precision of the receptor edges. Three different types of low-precision receptors have been designed and fabricated to study the alignment accuracy: 1) receptors with a single triangular defect pointing outward or inward with amplitude of 10, 30, and 60 μm and corresponding width of 20, 60, and 120 μm; 2) receptors with constant triangular edge jaggedness with amplitude of 2, 4, 5, and 15 μm; and 3) receptors with random triangular edge jaggedness with amplitude of 2, 4, and 8 μm. The DI water is used as the self-alignment medium. The alignment accuracy has been closely measured with an environmental scanning electron microscope. Numerical simulators, e.g., surface evolver have been used to analyze the results. The experimental results show that low-precision receptors impair alignment accuracy in a much lesser degree than the scale of the defects on a receptor.
Keywords
microassembling; numerical analysis; scanning electron microscopy; self-assembly; surface tension; DI water; constant triangular edge jaggedness; environmental scanning electron microscope; low-precision receptor impair alignment accuracy; microassembly; microchips; numerical simulators; random triangular edge jaggedness; self-alignment medium; surface evolver; surface tension-driven self-alignment; Accuracy; Liquids; Microassembly; Microscopy; Semiconductor device measurement; Shape; Surface tension; Microassembly; defects; hybrid assembly; self-alignment; self-assembly; surface tension; surface tension.;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2013.2293602
Filename
6684295
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