Research on the Micro Metal Droplet Printing for MEMS Packaging

Author

Jun, Luo ; Le-Hua, Qi ; Yuan, Xiao ; Ji-Ming, Zhou ; Fei-Fei, Chen

Author_Institution

Northwestern Polytech. Univ., Xian, China

Volume

3

fYear

2011

fDate

6-7 Jan. 2011

Firstpage

131

Lastpage

134

Abstract

A pneumatic drop-on-demand (DOD) system has been developed to print micro metal droplet for micro-electromechanical systems (MEMS) devices packaging. Solder droplets with mean size of 321.19 μm and standard deviation of 2.897 μm are obtained using the established system. The deposition results show that the volume of droplet can be accurately controlled. Droplet printing experiments at different temperatures are conducted to find out a way for obtaining perfect soldering. The results show that it is difficult to obtain a good wetting only by rising the substrate temperature during the printing process. Wetting between droplets and the substrate can be easily controlled by re-melting solid droplets that are accurately deposited.

Keywords

drops; electronics packaging; micromechanical devices; printing; soldering; solders; wetting; DOD system; MEMS packaging; microelectromechanical system device packaging; micrometal droplet printing; pneumatic drop-on-demand system; remelting solid droplets; size 2.897 mum; size 321.19 mum; solder droplets; substrate temperature; wetting; Connectors; Copper; Generators; Heating; Micromechanical devices; Substrates; drop-on-demand (DOD); packaging; printing; solder droplets;

fLanguage

English

Publisher

ieee

Conference_Titel

Measuring Technology and Mechatronics Automation (ICMTMA), 2011 Third International Conference on

Conference_Location

Shangshai

Print_ISBN

978-1-4244-9010-3

Type

conf

DOI

10.1109/ICMTMA.2011.604

Filename

5721441