Foreword: Silicon systems bridging the cloud

It is my pleasure to welcome you to the 61st International Solid-State Circuits Conference. The Conference continues its outstanding tradition of presenting the most-advanced and innovative work, both from industry and academe, worldwide, in the area of integrated circuits and systems. This year, the geographical distribution of the accepted technical papers illustrates the truly international character of the Conference: 41% of the accepted papers are from North America, 36% from the Far East, and 23% from Europe. Of all of these, 54% are from academe, 39% are from industry, and 7% from institutions/labs.