DocumentCode :
262636
Title :
Session 10 overview: Mobile Systems-on-Chip (SoCs): Energy-efficient digital subcommittee
Author :
Erraguntla, Vasantha ; Hashimoto, Takashi
Author_Institution :
Intel, Bangalore, India
fYear :
2014
fDate :
9-13 Feb. 2014
Firstpage :
174
Lastpage :
175
Abstract :
Mobile SoCs are becoming extremely complex to meet the relentless demand for more compute power and a richer user experience in mobile applications. Qualcomm´s Hexagon DSP in 28nm CMOS consumes 58mW/MHz at 0.6V, while Renesas and MediaTek present multicore heterogeneous processors with low power to achieve long battery life and boost performance by exploiting thermal headroom. A multicore processor from KAIST delivers a rich user experience with a 30fps 720p augmented reality chip for wearable electronics. To minimize standby-power, NEC introduces a 16b MTJ-based non-volatile microcontroller with low wakeup time among NV SoCs. Additionally, power-efficient digital baseband SoCs from imec, the Technical University of Dresden and Ericsson are presented, which support multi-standard communication at low power using fine-grain power management techniques.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
Conference_Location :
San Francisco, CA, USA
ISSN :
0193-6530
Print_ISBN :
978-1-4799-0918-6
Type :
conf
DOI :
10.1109/ISSCC.2014.6757556
Filename :
6757556
Link To Document :
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