• DocumentCode
    262639
  • Title

    Session 13 overview: Advanced embedded memory: Memory subcommittee

  • Author

    Chang, Jonathan ; Mair, Hugh

  • Author_Institution
    TSMC, Hsinchu, Taiwan
  • fYear
    2014
  • fDate
    9-13 Feb. 2014
  • Firstpage
    228
  • Lastpage
    229
  • Abstract
    Embedded memory continues to be a critical technology enabler for a wide range of applications from high-performance computing to mobile applications. This year´s conference highlights significant increases in on-chip capacity and bandwidth along with a continued drive towards advanced technology nodes while maintaining a strong focus on low-power operation. A 1Gb embedded DRAM using 22nm tri-gate CMOS logic technology is presented to meet the demands of bandwidth-intense applications. Papers in 14nm FinFET, 16nm FinFET, and 20nm planar technologies demonstrate state-of-the-art read/write assist techniques in order to challenge VMIN limitations. Various aspects of power and performance optimizations are highlighted in the session, including leakage power, dynamic power, latency, and throughput.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4799-0918-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2014.6757559
  • Filename
    6757559