DocumentCode
262639
Title
Session 13 overview: Advanced embedded memory: Memory subcommittee
Author
Chang, Jonathan ; Mair, Hugh
Author_Institution
TSMC, Hsinchu, Taiwan
fYear
2014
fDate
9-13 Feb. 2014
Firstpage
228
Lastpage
229
Abstract
Embedded memory continues to be a critical technology enabler for a wide range of applications from high-performance computing to mobile applications. This year´s conference highlights significant increases in on-chip capacity and bandwidth along with a continued drive towards advanced technology nodes while maintaining a strong focus on low-power operation. A 1Gb embedded DRAM using 22nm tri-gate CMOS logic technology is presented to meet the demands of bandwidth-intense applications. Papers in 14nm FinFET, 16nm FinFET, and 20nm planar technologies demonstrate state-of-the-art read/write assist techniques in order to challenge VMIN limitations. Various aspects of power and performance optimizations are highlighted in the session, including leakage power, dynamic power, latency, and throughput.
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
Conference_Location
San Francisco, CA, USA
ISSN
0193-6530
Print_ISBN
978-1-4799-0918-6
Type
conf
DOI
10.1109/ISSCC.2014.6757559
Filename
6757559
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