DocumentCode :
2626583
Title :
A Raised Source/Drain Extension pFET on Si [110] Realized by In-situ Doped Selective Epitaxy Technology
Author :
Wang, Jiacheng ; Kikuchi, Yutaka ; Tateshita, Y. ; Kato, Toshihiko ; Kataoka, Takeshi ; Hirano, Takuichi ; Nagano, Kotaro ; Ikuta, Takashi ; Miyanami, Y. ; Fujita, S. ; Hiyama, Shoko ; Yamamoto, Ryo ; Kanda, S. ; Yamakawa, Satoshi ; Kimura, Tomohiro ; Kug
Author_Institution :
Semicond. Technol. Dev. Group, Sony Corp., Kanagawa
fYear :
0
fDate :
0-0 0
Firstpage :
190
Lastpage :
191
Abstract :
A raised source/drain extension (RSDE) pFET on (110) Si wafer is demonstrated for the first time with in-situ doped selective epitaxy technology. Roll-off has been effectively improved, resulting from the elimination of ion channeling in (110) Si. Due to the hole mobility enhancement and parasitic resistance reduction, ion of 389muA/mum (Vd= -1.0 V) has been achieved at Lmin around 30nm extracted at Ioff = 100 nA/mum, which is 83% higher than that of conventional planar (100) pFET
Keywords :
MOSFET; elemental semiconductors; epitaxial growth; hole mobility; semiconductor doping; silicon; Si; Si (110); hole mobility enhancement; in-situ doping; pFET; parasitic resistance reduction; raised source-drain extension; selective epitaxy technology; Annealing; Atomic layer deposition; Dielectrics; Epitaxial growth; Etching; Fabrication; Ion implantation; MOSFET circuits; Oxidation; Silicon compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 2006. Digest of Technical Papers. 2006 Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
1-4244-0005-8
Type :
conf
DOI :
10.1109/VLSIT.2006.1705281
Filename :
1705281
Link To Document :
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