Session 26 overview: Energy-efficient dense interconnects: Wireline subcommittee

With the need for increased I/O bandwidth to support ever-increasing communication demands, the development of energy-efficient links that enable high-density interfaces is essential. This session presents 6 papers that introduce new high-speed aggregated serial-link techniques in advanced CMOS technologies. These designs address the demands of a range of key applications, from dense chip-to-chip communications to high-bandwidth memory access.