Title :
Table of contents
Abstract :
The following topics are dealt with: complex analog behaviors; Internet of Things; robust energy systems; high volume manufacturing; RF test; fool Nyquist, fix nonlinearity, tolerate jitter; embedded systems; MEMS devices testing; packaging and probing; embedded memories; Big Data; AMS design; 3D test; RAM test and repair; functional testing; ATPG; logic test compression-logic BIST; and analog design-for-test.
Keywords :
Big Data; Internet of Things; automatic test pattern generation; built-in self test; data compression; design for testability; electronics packaging; embedded systems; integrated circuit manufacture; integrated circuit testing; jitter; logic circuits; logic testing; micromechanical devices; random-access storage; 3D test; AMS design; ATPG; Big Data; Internet of Things; MEMS devices testing; RAM repair; RAM test; RF test; analog design-for-test; complex analog behaviors; embedded memories; embedded systems; fix nonlinearity; fool Nyquist; functional testing; high volume manufacturing; jitter tolerance; logic BIST; logic test compression; packaging; probing; robust energy systems;
Conference_Titel :
Test Conference (ITC), 2014 IEEE International
Conference_Location :
Seattle, WA
DOI :
10.1109/TEST.2014.7035247
