DocumentCode :
2627105
Title :
Integrating Chip Carrier Packaging Technology Into Avionic Systems
Author :
Bones, E.C. ; Chappell, C.D.
Author_Institution :
Sperry Corporation
fYear :
1998
fDate :
17-17 July 1998
Firstpage :
271
Lastpage :
278
Keywords :
Aerospace electronics; Automatic testing; Electric shock; Humidity; Packaging; Power system reliability; Sea surface; Soldering; Surface-mount technology; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace and Electronics Conference, 1998. NAECON 1998. Proceedings of the IEEE 1998 National
Conference_Location :
Dayton, OH, USA
ISSN :
0547-3578
Print_ISBN :
0-7803-4449-9
Type :
conf
DOI :
10.1109/NAECON.1998.710127
Filename :
710127
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2627105
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