Achieving extreme scan compression for SoC Designs

High volume testing of complex System on Chip (SoC) designs at reasonable test cost requires high test data and test time compression. We present a multilevel scan compression architecture that combines a flexible test compression core with an efficient dynamic broadcast structure and a high speed data access technique. Full X-tolerance, power-aware scan shift and diagnosis are supported through the entire architecture. We present a flow for assembling the various components that limits the impact on area and timing by minimizing test signals and improving modularity of the inserted design-for-test (DFT) structures. These techniques provided a reduction of 600x in test data volume and over 2300x in test time on large Graphics Processor Units (GPU) designs.