Title :
Printed Circuit Board vibration analysis using simplified finite element models
Author :
Burmitskih, Anton V. ; Lebedev, Aleksandr P. ; Levitskiy, Alexey A. ; Moskovskih, Mikhail S.
Author_Institution :
Siberian Fed. Univ., Krasnoyarsk, Russia
Abstract :
Vibration and shock loadings can lead to an operating mode violation of the electronic equipment, Printed Circuit Board (PCB) and electronic components failure. A major difficulty with PCB vibration response prediction is caused by influence of electronic components, as the components effectively increase the mass and stiffness of the PCB. The problem can be solved by using simplified method based on addition the mass and stiffness of the components to the PCB model. This work developed a methodology of PCB vibration analysis using simplified finite element models.
Keywords :
failure analysis; finite element analysis; printed circuits; PCB vibration analysis; electronic component failure; electronic equipment; printed circuit board; shock loadings; simplified finite element models; vibration loadings; Analytical models; Finite element analysis; Integrated circuit modeling; Iron; Load modeling; Numerical models; Vibrations; BGA; printed circuit board (PCB) vibrations; testing; vibration; vibration endurance;
Conference_Titel :
Control and Communications (SIBCON), 2013 International Siberian Conference on
Conference_Location :
Krasnoyarsk
Print_ISBN :
978-1-4799-1060-1
DOI :
10.1109/SIBCON.2013.6693570
