DocumentCode
2627965
Title
Virtual-EMI lab: Removing mysteries from black-magic to a successful front-end design
Author
Fahmy, Hany ; Wang, Chen ; Pissoort, Davy ; Badesha, Amolak
Author_Institution
Nvidia Corp., Santa Clara, CA, USA
fYear
2010
fDate
9-12 May 2010
Firstpage
105
Lastpage
108
Abstract
EMI engineers are struggling everyday with complex radiation problems that fail critical products to pass EMI certification and causes big loss of profit. Advances in EMI engineering are following a similar trend like Signal-Integrity engineering 10-years ago when simulation tools became capable of providing accurate predictive simulations in a reasonable amount of time. With careful engineering utilizing cutting-edge full-wave field-solver software: Momentum (MOM), EMpro (FDTD) along with a hardware boost with heterogeneous massive CPU/GPU parallel processing (CUDA) technology, we can move the EMI teams from the back-end black-magic to a successful cost-effective front-end design. This paper presents an innovative process (Virtual-EMI lab) for pre- and post-tape-out providing the designers with an early stage EMI-suppression matrix (on-chip and onboard enablers) to find the optimum trade-off between performance and cost.
Keywords
certification; computer graphic equipment; electrical engineering computing; electromagnetic interference; interference suppression; laboratories; parallel processing; software tools; virtual reality; CUDA technology; EMI certification; EMI suppression matrix; EMpro software; FDTD; GPU parallel processing technology; Momentum software; cost-effective front-end design; cutting-edge full-wave field-solver software; heterogeneous massive CPU technology; signal integrity engineering; virtual-EMI lab; Certification; Cost function; Design engineering; Electromagnetic interference; Finite difference methods; Hardware; Message-oriented middleware; Parallel processing; Predictive models; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects (SPI), 2010 IEEE 14th Workshop on
Conference_Location
Hildesheim
Print_ISBN
978-1-4244-7611-4
Type
conf
DOI
10.1109/SPI.2010.5483555
Filename
5483555
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