• DocumentCode
    2627965
  • Title

    Virtual-EMI lab: Removing mysteries from black-magic to a successful front-end design

  • Author

    Fahmy, Hany ; Wang, Chen ; Pissoort, Davy ; Badesha, Amolak

  • Author_Institution
    Nvidia Corp., Santa Clara, CA, USA
  • fYear
    2010
  • fDate
    9-12 May 2010
  • Firstpage
    105
  • Lastpage
    108
  • Abstract
    EMI engineers are struggling everyday with complex radiation problems that fail critical products to pass EMI certification and causes big loss of profit. Advances in EMI engineering are following a similar trend like Signal-Integrity engineering 10-years ago when simulation tools became capable of providing accurate predictive simulations in a reasonable amount of time. With careful engineering utilizing cutting-edge full-wave field-solver software: Momentum (MOM), EMpro (FDTD) along with a hardware boost with heterogeneous massive CPU/GPU parallel processing (CUDA) technology, we can move the EMI teams from the back-end black-magic to a successful cost-effective front-end design. This paper presents an innovative process (Virtual-EMI lab) for pre- and post-tape-out providing the designers with an early stage EMI-suppression matrix (on-chip and onboard enablers) to find the optimum trade-off between performance and cost.
  • Keywords
    certification; computer graphic equipment; electrical engineering computing; electromagnetic interference; interference suppression; laboratories; parallel processing; software tools; virtual reality; CUDA technology; EMI certification; EMI suppression matrix; EMpro software; FDTD; GPU parallel processing technology; Momentum software; cost-effective front-end design; cutting-edge full-wave field-solver software; heterogeneous massive CPU technology; signal integrity engineering; virtual-EMI lab; Certification; Cost function; Design engineering; Electromagnetic interference; Finite difference methods; Hardware; Message-oriented middleware; Parallel processing; Predictive models; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects (SPI), 2010 IEEE 14th Workshop on
  • Conference_Location
    Hildesheim
  • Print_ISBN
    978-1-4244-7611-4
  • Type

    conf

  • DOI
    10.1109/SPI.2010.5483555
  • Filename
    5483555