• DocumentCode
    262806
  • Title

    A reusable BIST with software assisted repair technology for improved memory and IO debug, validation and test time

  • Author

    Querbach, Bruce ; Khanna, Rahul ; Blankenbeckler, David ; Yulan Zhang ; Anderson, Ronald T. ; Ellis, David G. ; Schoenborn, Zale T. ; Deyati, Sabyasachi ; Chiang, Patrick

  • Author_Institution
    Intel Corp., Hillsboro, OR, USA
  • fYear
    2014
  • fDate
    20-23 Oct. 2014
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    As silicon integration complexity increases with 3D stacking and Through-Silicon-Via (TSV), so does the occurrence of memory and IO defects and associated test and validation time. This ultimately leads to an overall cost increase. On a 14nm Intel SOC, a reusable BIST engine called Converged-Pattern-Generator-Checker (CPGC) are architected to detect memory and IO defects, and combined with the software assisted repair technology to automatically repair memory cell defects on 3D stacked Wide-IO DRAM. Additionally, we also present the CPGC gate count, power, simulation, and silicon results. The reusable CPGC IP is designed to connect to a standard IP interface, which enables a quick turn-key SOC development cycle. Silicon results show CPGC can speed up validation by 5x, improve test time from minutes down to seconds, and decrease debug time by 5x including root-cause of boot failures of the memory interface. CPGC is also used in memory training and initialization, which makes it a critical part of Intel SOC.
  • Keywords
    DRAM chips; built-in self test; elemental semiconductors; logic testing; silicon; system-on-chip; three-dimensional integrated circuits; 3D stacking; BIST; IO debug; Intel SOC; Si; TSV; built-in self test; converged-pattern-generator-checker; memory cell defects; size 14 nm; software assisted repair technology; through-silicon-via; wide-IO DRAM; Built-in self-test; Circuit faults; Computer architecture; IP networks; Maintenance engineering; Random access memory; Software; High speed IO; Memory Array Test Engine; Memory IO; Memory Interface Training; Post Package Repair; hardware/software calibration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference (ITC), 2014 IEEE International
  • Conference_Location
    Seattle, WA
  • Type

    conf

  • DOI
    10.1109/TEST.2014.7035340
  • Filename
    7035340