Title :
A test probe for TSV using resonant inductive coupling
Author :
Rashidzadeh, Rashid ; Basith, Iftekhar Ibne
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Windsor, Windsor, ON, Canada
Abstract :
A contactless TSV probe based on the principle of resonant inductive coupling is presented in this work. The proposed scheme allows TSV data observation up to 2Gbps when the probe and TSV are 15μm apart.
Keywords :
three-dimensional integrated circuits; TSV data observation; contactless TSV probe; distance 15 mum; resonant inductive coupling; test probe; Couplings; Inductors; Probes; RLC circuits; Resonant frequency; Testing; Through-silicon vias;
Conference_Titel :
Test Conference (ITC), 2014 IEEE International
Conference_Location :
Seattle, WA
DOI :
10.1109/TEST.2014.7035367
