DocumentCode
2628810
Title
Table of contents
fYear
2010
fDate
9-12 May 2010
Firstpage
1
Lastpage
4
Abstract
The following topics are dealt with: interconnect modeling; power integrity; frequency domain simulation; parameter extraction; interconnect measurement; interconnect reliability; model order reduction; interconnect technologies; signal integrity; EMC; and macromodeling.
Keywords
integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit reliability; EMC; frequency domain simulation; interconnect measurement; interconnect reliability; interconnection modeling; macromodeling; model order reduction; parameter extraction; power integrity; signal integrity;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects (SPI), 2010 IEEE 14th Workshop on
Conference_Location
Hildesheim
Print_ISBN
978-1-4244-7611-4
Type
conf
DOI
10.1109/SPI.2010.5483600
Filename
5483600
Link To Document