Prediction of transmission line lifetimes over temperature and current density

As die sizes continue to shrink in an effort to reduce cost, larger current densities must be carried by transmission lines (TLs). In the III-V semiconductor industry, a common material used in TLs is gold for its low resistivity and high electromigration resistance. Our concern here is to determine the effect of current density and temperature under high stress conditions and extrapolate to low stress (use conditions) in order to find a realistic design rule...