DocumentCode
263003
Title
Evidence of the interphase in epoxy nanocomposites
Author
Seiler, J. ; Kindersberger, J.
Author_Institution
Inst. for High Voltage Eng. & Switchgear Technol., Tech. Univ. Muenchen, Munich, Germany
fYear
2014
fDate
8-11 Sept. 2014
Firstpage
1
Lastpage
4
Abstract
The improvement of electrical properties by adding nanoscale fillers to polymeric insulating materials is attributed to an interfacial area, the interphase, which is formed between the filler particles and the polymer matrix. Despite there are several models describing the interphase, a direct evidence for its existence in epoxy nanocomposites has not been provided so far. It is the aim of the present study to make the interphase visible. For this purpose nanoscale silica particles themselves and the same type of silica particles embedded in an epoxy nanocomposite were investigated by Atomic Force Microscopy (AFM) and Electric Force Microscopy (EFM). In the EFM images the filler particles appear larger when they are embedded in the composite material than they do when they are not embedded. This difference in size is attributed to the interphase surrounding the filler particles. By comparing the size of the filler particles themselves and the filler particles embedded in the composite material the thickness of the interphase is estimated. From the investigations it turns out that an interphase may be formed around filler particles in epoxy nanocomposites, and that AFM and EFM measurements are an appropriate method to make the interphase visible.
Keywords
atomic force microscopy; epoxy insulation; filled polymers; nanocomposites; phase estimation; AFM; EFM; atomic force microscopy; electric force microscopy; electrical property; epoxy nanocomposite material; interphase estimation; nanoscale filler; nanoscale silica particle; polymer matrix; polymeric insulating material; Atomic force microscopy; Force; Nanocomposites; Silicon compounds; Surface topography;
fLanguage
English
Publisher
ieee
Conference_Titel
High Voltage Engineering and Application (ICHVE), 2014 International Conference on
Conference_Location
Poznan
Type
conf
DOI
10.1109/ICHVE.2014.7035442
Filename
7035442
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