Title :
Upgraded EMC modelling of dual die structure
Author :
Zhu, Boyuan ; Lu, Junwei ; Stegen, Sascha ; Li, Erping
Author_Institution :
Sch. of Eng., Griffith Univ., Brisbane, QLD, Australia
fDate :
Aug. 16 2009-Sept. 18 2009
Abstract :
Due to the variety of internal structures applied in different processors, EMC modelling should also be upgraded correspondingly. This paper presents an upgraded EMC simulation model of dual die structure which is originated from the IEEE electromagnetic challenging problem 2000-4 for conventional CPU with heatsink. The simulation results are verified by measurement with a fabricated model. Furthermore, a consequent benchmark will be provided.
Keywords :
electromagnetic compatibility; heat sinks; integrated circuit packaging; microprocessor chips; CPU; EMC modelling; IEEE electromagnetic challenging problem 2000-4; dual die processor; electromagnetic measurement; heatsink; Bridge circuits; Control systems; Educational institutions; Electromagnetic compatibility; Fabrication; High power amplifiers; L-band; Microwave circuits; Power amplifiers; Transmitters; Benchmark; Dual Die; EMC; Modelling;
Conference_Titel :
Electromagnetic Compatibility Symposium Adelaide, 2009.
Conference_Location :
Adelaide, SA
Print_ISBN :
978-1-4244-4674-2
Electronic_ISBN :
978-1-4244-4675-9
DOI :
10.1109/EMCSA.2009.5349765
