DocumentCode :
263183
Title :
Memory BIST for on-chip monitoring of resistive-open defects due to electromigration and stress-induced voiding in an SRAM array
Author :
Woongrae Kim ; Soonyoung Cha ; Milor, Linda
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2014
fDate :
26-28 Nov. 2014
Firstpage :
1
Lastpage :
6
Abstract :
We present a Built-in Self Test (BIST) methodology for on-chip failure analysis of via/contact voiding due to electromigration (EM) and stress-induced voiding (SIV) in SRAM cells. Our BIST system aims to detect wearout in faulty cells and identify the location of the failure in the cell. This enables more efficient physical failure analysis.
Keywords :
SRAM chips; built-in self test; electromigration; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; vias; voids (solid); SRAM array; electromigration; memory BIST; on-chip failure analysis; on-chip monitoring; resistive open defect; stress induced voiding; via-contact voiding; Algorithm design and analysis; Built-in self-test; Circuit faults; Fault diagnosis; Maintenance engineering; Resistance; SRAM cells;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design of Circuits and Integrated Circuits (DCIS), 2014 Conference on
Conference_Location :
Madrid
Type :
conf
DOI :
10.1109/DCIS.2014.7035560
Filename :
7035560
Link To Document :
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