DocumentCode
2632189
Title
A novel Intelligent Power Module (IPM) in a compact transfer Mold package with New High Voltage Integrated Circuit (HVIC) and integrated bootstrap diodes
Author
Özkiliç, Mustafa Cem ; Honsberg, Marco ; Radke, Thomas
Author_Institution
OHM Elektron., İstanbul, Turkey
fYear
2010
fDate
6-8 Sept. 2010
Abstract
Transfer Mold IPM employs a novel insulated thermal sheet technology and Full-Gate CSTBT™ ranging from 5A to 15A with blocking voltage of 600V. The complete protection functions and the novel HVIC and bootstrap diode being integrated into the package structure create a state-of-the-art IPM which can be evaluated easily by the described evaluation platform.
Keywords
bootstrap circuits; power integrated circuits; transfer moulding; bootstrap diode; compact transfer mold package; current 5 A to 15 A; high voltage integrated circuit; insulated thermal sheet technology; intelligent power module; protection function; voltage 600 V; Capacitors; Delay; Insulated gate bipolar transistors; Logic gates; Resistance; Temperature sensors; Thermal conductivity; High Voltage IC´s efficiency; IGBT; JPM (Intelligent Power Module);
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Motion Control Conference (EPE/PEMC), 2010 14th International
Conference_Location
Ohrid
Print_ISBN
978-1-4244-7856-9
Type
conf
DOI
10.1109/EPEPEMC.2010.5606819
Filename
5606819
Link To Document