DocumentCode :
2632640
Title :
Circuit design challenges in embedded memory and resistive RAM (RRAM) for mobile SoC and 3D-IC
Author :
Chang, Meng-Fan ; Chiu, Pi-Feng ; Sheu, Shyh-Shyuan
Author_Institution :
Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear :
2011
fDate :
25-28 Jan. 2011
Firstpage :
197
Lastpage :
203
Abstract :
Mobile systems require high-performance and low-power SoC or 3D-IC chips to perform complex operations, ensure a small form-factor and ensure a long battery life time. A low supply voltage (VDD) is frequently utilized to suppress dynamic power consumption, standby current, and thermal effects in SoC and 3D-IC. Furthermore, lowering the VDD reduces the voltage stress of the devices and slows the aging of chips. However, a low VDD for embedded memories can cause functional failure and low yield. This paper reviews various challenges in the design of low-voltage circuits for embedded memory (SRAM and ROM). It also discusses emerging embedded memory solutions. Alternative memory interfaces and architectures for mobile SoC and 3D-IC are also explored.
Keywords :
embedded systems; mobile communication; random-access storage; system-on-chip; three-dimensional integrated circuits; 3D-IC chips; ROM; SRAM; circuit design challenges; dynamic power consumption; embedded memories; embedded memory solutions; functional failure; high-performance SoC; long battery life time; low supply voltage; low-power SoC; low-voltage circuits; memory architecture; memory interface; mobile SoC; mobile systems; resistive RAM; standby current; thermal effects; voltage stress; Computer architecture; Microprocessors; Mobile communication; Nonvolatile memory; Power demand; Random access memory; System-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference (ASP-DAC), 2011 16th Asia and South Pacific
Conference_Location :
Yokohama
ISSN :
2153-6961
Print_ISBN :
978-1-4244-7515-5
Type :
conf
DOI :
10.1109/ASPDAC.2011.5722184
Filename :
5722184
Link To Document :
بازگشت