Thermal management of an integrated power module with multiple power devices

Author

Ganesa-Pillai, Madhu ; Chen, Qing

Author_Institution

Power Syst., Lucent Technologies, Mesquite, TX, USA

fYear

2000

fDate

2000

Firstpage

245

Lastpage

251

Abstract

This paper presents a thermal analysis of an integrated boost converter module by the finite element method. The basic idea in this power module is to integrate all the semiconductor devices and the snubber circuits of a boost converter on a ceramic substrate. This integration results in a more compact packaging of the boost converter with better thermal performance. Finite element analysis (FEA) is performed using the ANSYS software package. The effects of different substrates and use of multiple current sharing components are studied

Keywords

AC-DC power convertors; circuit simulation; finite element analysis; heat sinks; power integrated circuits; power semiconductor devices; power supplies to apparatus; rectifying circuits; thermal analysis; thermal management (packaging); ANSYS software package; boost converter; ceramic substrate; finite element analysis; finite element method; integrated power module; multiple current sharing components; multiple power devices; semiconductor devices; snubber circuits; thermal analysis; thermal management; Ceramics; Circuits; Energy management; Finite element methods; Multichip modules; Semiconductor device packaging; Semiconductor devices; Snubbers; Substrates; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Telecommunications Energy Conference, 2000. INTELEC. Twenty-second International

Conference_Location

Phoenix, AZ

Print_ISBN

0-7803-6407-4

Type

conf

DOI

10.1109/INTLEC.2000.884257

Filename

884257