Title :
CPI challenges to BEOL at 28nm node and beyond
Author :
Ryan, Vivian ; Breuer, Dirk ; Geisler, Holm ; Kioussis, Dimitri ; Lehr, Matthias U. ; Paul, Jens ; Machani, Kashi ; Shah, Chirag ; Kosgalwies, Sven ; Lehmann, Lothar ; Lee, Jaesik ; Kuechenmeister, Frank ; Ryan, E. Todd ; Karimanal, Kamal
Author_Institution :
GLOBALFOUNDRIES Inc., Albany, NY, USA
Abstract :
We address package-induced degradation of BEOL interconnects and approaches for recovery. For dielectrics, we cover process options and position in stack for ULK films and how these lead to differences in strength. Experiments were designed to cross-compare multiple methods to test susceptibility of BEOL interconnect to CPI damage. We also address how Chip Package Interaction changes as BEOL features and layout evolve.
Keywords :
dielectric materials; integrated circuit interconnections; integrated circuit layout; integrated circuit packaging; BEOL interconnects; BEOL layout; CPI damage; ULK films; chip package interaction; cross-compare multiple method; dielectrics; package-induced degradation; process option; size 28 nm; Acceleration; Assembly; Films; Integrated circuit interconnections; Layout; Metals; Stress; ULK; chip; low-k; package; white bump;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2012 IEEE International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4577-1678-2
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2012.6241788
