• DocumentCode
    2633392
  • Title

    All-out fight against yield losses by design-manufacturing collaboration in nano-lithography era

  • Author

    Inoue, Soichi ; Kobayashi, Sachiko

  • Author_Institution
    Adv. Lithography Process Technol. Dept., Toshiba Corp., Kawasaki, Japan
  • fYear
    2011
  • fDate
    25-28 Jan. 2011
  • Firstpage
    395
  • Lastpage
    401
  • Abstract
    The concept of design-manufacturing collaboration for nano-lithography era has been clarified. The novel design-manufacturing system that the manufacturing tolerance reflecting design intention properly can be allocated to the layout has been proposed. According to the system, one can assign the “weak portion” explicitly on the layout, and can control the process for reducing the burden of manufacturing and further getting higher yield. More specifically, the extraction of electrically critical portion and conversion to the manufacturing tolerance has been demonstrated. The tolerance has applied to reduce computational burden of mask data preparation. Besides, the yield model-based layout scoring system has been also suggested to be significant remarkably. One can check the layout and modify not to loose the yield. Creation of yield function, layout scoring, and layout modification based upon the yield model have been demonstrated.
  • Keywords
    design for manufacture; integrated circuit layout; integrated circuit yield; masks; nanolithography; all-out fight against yield losses; computational burden; design intention; design-manufacturing collaboration; design-manufacturing system; electrically critical portion; layout modification; manufacturing tolerance; mask data preparation; nano-lithography era; yield function; yield model-based layout scoring system; Collaboration; Crosstalk; Layout; Lithography; Logic gates; Optimization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2011 16th Asia and South Pacific
  • Conference_Location
    Yokohama
  • ISSN
    2153-6961
  • Print_ISBN
    978-1-4244-7515-5
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2011.5722220
  • Filename
    5722220