• DocumentCode
    2633658
  • Title

    A Hazard-Free Delay-Insensitive 4-phase On-Chip Link Using MVCM Signaling

  • Author

    Fattah, Mohammad ; Moghaddam, Soodeh Aghli ; Mohammadi, Siamak

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Univ. of Tehran, Tehran, Iran
  • fYear
    2009
  • fDate
    27-29 Aug. 2009
  • Firstpage
    61
  • Lastpage
    66
  • Abstract
    In this paper, we introduce a 3 valued MVCM 4-phase link, where cores at each end of the link use 4-phase dual-rail protocol. The dual-rail N-bit data are encoded onto N + 1 wires on the link, thus reducing the number of interconnects between cores and improving power and crosstalk features. We show that it is impractical to encode a 2-phase dual-rail asynchronous data bit onto one wire using MVCM signaling, which was used in previous works, as it generates an unavoidable hazard at the receiver end. The main advantage of our design is that it does not generate any hazards. To evaluate our claim, we use a simple transmitter and receiver implemented in 130 nm technology. Results show a hazard-free communication over different link lengths in contrast to previous works.
  • Keywords
    current-mode circuits; integrated circuit design; integrated circuit interconnections; network-on-chip; system-on-chip; NoC design; SoC design; dual-rail N-bit data; dual-rail protocol; hazard-free communication; hazard-free delay-insensitive four-phase on-chip link; interconnection lines; multiple-valued current-mode signaling; receiver implementation; size 130 nm; transmitter implementation; two-phase dual-rail asynchronous data bit; Clocks; Crosstalk; Delay; Hazards; Integrated circuit interconnections; Network-on-a-chip; Protocols; Signal design; Voltage; Wire; MVCM; NOC; SOC; asynchronous; current mode signalling; delay insensitive; link;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Digital System Design, Architectures, Methods and Tools, 2009. DSD '09. 12th Euromicro Conference on
  • Conference_Location
    Patras
  • Print_ISBN
    978-0-7695-3782-5
  • Type

    conf

  • DOI
    10.1109/DSD.2009.212
  • Filename
    5349977