DocumentCode :
2633852
Title :
Fundamental failure mechanisms limiting maximum voltage operation in AlGaN/GaN HEMTs
Author :
Hodge, Michael D. ; Vetury, Ramakrishna ; Shealy, Jeffrey B.
Author_Institution :
RF Micro Devices, Univ. of North Carolina at Charlotte, Charlotte, NC, USA
fYear :
2012
fDate :
15-19 April 2012
Abstract :
The authors report on the fundamental failure mechanisms limiting maximum applied voltage in AlGaN/GaN HEMTs. Device failure in high voltage off state conditions was studied by controlling drain leakage current and maximum applied drain voltage simultaneously. It was found that failure was associated with loss in gate control of channel current and a permanent degradation of gate diode leakage current. No permanent significant change until device failure was observed in ON-state parameters such as Ron, Idss and Idmax, thus distinguishing this failure mode from the inverse pieozo-electric effect as reported in literature.
Keywords :
III-V semiconductors; aluminium compounds; failure analysis; gallium compounds; high electron mobility transistors; integrated circuit reliability; wide band gap semiconductors; AlGaN-GaN; AlGaN/GaN HEMT; ON-state parameter; device failure; drain leakage current control; drain voltage; failure mode; fundamental failure mechanism; gate control; gate diode leakage current; inverse pieozo-electric effect; maximum voltage operation; permanent degradation; Breakdown voltage; Degradation; Electric breakdown; Gallium nitride; Leakage current; Logic gates; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2012 IEEE International
Conference_Location :
Anaheim, CA
ISSN :
1541-7026
Print_ISBN :
978-1-4577-1678-2
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2012.6241816
Filename :
6241816
Link To Document :
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