DocumentCode :
2633977
Title :
Negotiation-based layer assignment for via count and via overflow minimization
Author :
Liu, Wen-Hao ; Li, Yih-Lang
Author_Institution :
Dept. of Comput. Sci., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
fYear :
2011
fDate :
25-28 Jan. 2011
Firstpage :
539
Lastpage :
544
Abstract :
Layer assignment determines on which layer the wires or vias should be placed; and the assignment results influence the circuit´s delay, crosstalk, and via counts. How to minimize via count and via overflow during layer assignment has received considerable attention in recent years. Traditional layer assignment to minimize via count tends to produce varying qualities of assignment results using different net orderings. This work develops a negotiation-based via count minimization algorithm (NVM) that can achieve lower via counts than in previous works, and experimental results indicate that net assignment ordering only slightly influences the quality of NVM´s results. As for via overflow minimization, we observe via overflow can be well minimized if via overflow minimization is performed following stacked via minimization. The stacked via minimization adopts the proposed NVM, while via overflow minimization adopts a modified NVM by replacing via cost with via overflow cost. Experimental results reveal that the proposed NVM yields a lower additional via cost than and by 10.8%, 2.5%, respectively, in the via count minimization problem. As for via overflow minimization, the proposed two-stage algorithm improves via overflow by 11.5% and lowers the via cost by 6.5% than the one-stage algorithm.
Keywords :
minimisation; network routing; negotiation-based layer assignment; negotiation-based via count minimization algorithm; net assignment ordering; one-stage algorithm; stacked via minimization; via overflow cost; via overflow minimization; Decision support systems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference (ASP-DAC), 2011 16th Asia and South Pacific
Conference_Location :
Yokohama
ISSN :
2153-6961
Print_ISBN :
978-1-4244-7515-5
Type :
conf
DOI :
10.1109/ASPDAC.2011.5722248
Filename :
5722248
Link To Document :
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