DocumentCode :
2634142
Title :
Throughput optimization for latency-insensitive system with minimal queue insertion
Author :
Huang, Juinn-Dar ; Chen, Yi-Hang ; Ho, Ya-Chien
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2011
fDate :
25-28 Jan. 2011
Firstpage :
585
Lastpage :
590
Abstract :
As fabrication process exploits even deeper submicron technology, global interconnect delay is becoming one of the most critical performance obstacles in system-on-chip (SoC) designs nowadays. Recent years latency-insensitive system (LIS), which enables multicycle communication to tolerate variant interconnect delay without substantially modifying pre-designed IP cores, has been proposed to conquer this issue. However, imbalanced interconnect latency and communication back-pressure residing in an LIS still degrade system throughput. In this paper, we present a throughput optimization technique with minimal queue insertion. We first model a given LIS as a quantitative graph (QG), which can be further compacted using the proposed techniques, so that much bigger problems can be handled. On top of QG, the optimal solution with minimal queue size can be achieved through integer linear programming based on the proposed constraint formulation in an acceptable runtime. The experimental results show that our approach can deal with moderately large systems in a reasonable runtime and save about 28% of queues compared to the prior art.
Keywords :
graph theory; integer programming; linear programming; logic design; system-on-chip; LIS; QG; SoC design; global interconnect delay; integer linear programming; latency-insensitive system; minimal queue insertion; multicycle communication; quantitative graph; submicron technology; system-on-chip; throughput optimization; variant interconnect delay; Compaction; Delay; IP networks; Optimization; Relays; System-on-a-chip; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference (ASP-DAC), 2011 16th Asia and South Pacific
Conference_Location :
Yokohama
ISSN :
2153-6961
Print_ISBN :
978-1-4244-7515-5
Type :
conf
DOI :
10.1109/ASPDAC.2011.5722257
Filename :
5722257
Link To Document :
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