DocumentCode
2634142
Title
Throughput optimization for latency-insensitive system with minimal queue insertion
Author
Huang, Juinn-Dar ; Chen, Yi-Hang ; Ho, Ya-Chien
Author_Institution
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear
2011
fDate
25-28 Jan. 2011
Firstpage
585
Lastpage
590
Abstract
As fabrication process exploits even deeper submicron technology, global interconnect delay is becoming one of the most critical performance obstacles in system-on-chip (SoC) designs nowadays. Recent years latency-insensitive system (LIS), which enables multicycle communication to tolerate variant interconnect delay without substantially modifying pre-designed IP cores, has been proposed to conquer this issue. However, imbalanced interconnect latency and communication back-pressure residing in an LIS still degrade system throughput. In this paper, we present a throughput optimization technique with minimal queue insertion. We first model a given LIS as a quantitative graph (QG), which can be further compacted using the proposed techniques, so that much bigger problems can be handled. On top of QG, the optimal solution with minimal queue size can be achieved through integer linear programming based on the proposed constraint formulation in an acceptable runtime. The experimental results show that our approach can deal with moderately large systems in a reasonable runtime and save about 28% of queues compared to the prior art.
Keywords
graph theory; integer programming; linear programming; logic design; system-on-chip; LIS; QG; SoC design; global interconnect delay; integer linear programming; latency-insensitive system; minimal queue insertion; multicycle communication; quantitative graph; submicron technology; system-on-chip; throughput optimization; variant interconnect delay; Compaction; Delay; IP networks; Optimization; Relays; System-on-a-chip; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference (ASP-DAC), 2011 16th Asia and South Pacific
Conference_Location
Yokohama
ISSN
2153-6961
Print_ISBN
978-1-4244-7515-5
Type
conf
DOI
10.1109/ASPDAC.2011.5722257
Filename
5722257
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