• DocumentCode
    2634142
  • Title

    Throughput optimization for latency-insensitive system with minimal queue insertion

  • Author

    Huang, Juinn-Dar ; Chen, Yi-Hang ; Ho, Ya-Chien

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2011
  • fDate
    25-28 Jan. 2011
  • Firstpage
    585
  • Lastpage
    590
  • Abstract
    As fabrication process exploits even deeper submicron technology, global interconnect delay is becoming one of the most critical performance obstacles in system-on-chip (SoC) designs nowadays. Recent years latency-insensitive system (LIS), which enables multicycle communication to tolerate variant interconnect delay without substantially modifying pre-designed IP cores, has been proposed to conquer this issue. However, imbalanced interconnect latency and communication back-pressure residing in an LIS still degrade system throughput. In this paper, we present a throughput optimization technique with minimal queue insertion. We first model a given LIS as a quantitative graph (QG), which can be further compacted using the proposed techniques, so that much bigger problems can be handled. On top of QG, the optimal solution with minimal queue size can be achieved through integer linear programming based on the proposed constraint formulation in an acceptable runtime. The experimental results show that our approach can deal with moderately large systems in a reasonable runtime and save about 28% of queues compared to the prior art.
  • Keywords
    graph theory; integer programming; linear programming; logic design; system-on-chip; LIS; QG; SoC design; global interconnect delay; integer linear programming; latency-insensitive system; minimal queue insertion; multicycle communication; quantitative graph; submicron technology; system-on-chip; throughput optimization; variant interconnect delay; Compaction; Delay; IP networks; Optimization; Relays; System-on-a-chip; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2011 16th Asia and South Pacific
  • Conference_Location
    Yokohama
  • ISSN
    2153-6961
  • Print_ISBN
    978-1-4244-7515-5
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2011.5722257
  • Filename
    5722257