Study of structural fabrication process of Film Bulk Acoustic Resonator (FBAR)

Thin film bulk acoustic resonator, grown based on the MEMS fabrication technology simultaneously, has become one of the most positive devices within the area of wireless communication application. FBAR has such distinct advantages as higher frequency, smaller volume, better power handling capabilities, higher Q-values and well compatibility with IC techniques. The paper briefly introduces the operational principle of FBAR, and then discusses the detailed characters and structural fabrication processes of three kinds of FBAR. The mainly package technology of FBAR will also be described.