Title :
Implantable electrical feedthrough reliability demonstration testing and life prediction
Author :
Fang, Zhi ; Thom, Andy ; Nygren, Lea
Author_Institution :
Medtronic Energy & Component Center, Medtronic Inc., Minneapolis, MN, USA
Abstract :
An accelerated life test has been developed for rapidly evaluation of implantable medical device feedthrough (FT) hermeticity performance. The accelerated test allows for process and/or design optimization in order maximize characterize the hermeticity longevity in a relative short period of time. A zero failure reliability demonstration approach has been developed to demonstrate the new FT designs met the reliability goals using quantitative accelerated life tests. FT design A, has demonstrated a reliability level of R>;0.9994 at 95% confidence with respect to 20 year 37°C hermetic life based on zero failure reliability demonstration testing (150°C, 175°C and 200°C tests). FT design B has demonstrated a reliability level of R>;0.9999 at 95% confidence with respect to 5 year 37°C hermetic life based on zero failure reliability demonstration approach (150°C and 175°C tests) or modeling failure data (200°C tests).
Keywords :
biomedical electronics; integrated circuit design; integrated circuit reliability; integrated circuit testing; life testing; prosthetics; FT design; FT hermeticity performance; design optimization; failure data modeling; hermetic life; hermeticity longevity; implantable electrical feedthrough; implantable medical device feedthrough; life prediction; process optimization; quantitative accelerated life test; reliability goal; reliability level; temperature 150 C; temperature 175 C; temperature 200 C; temperature 37 C; time 20 year; time 5 year; zero failure reliability demonstration testing; Acceleration; Data models; Life estimation; Predictive models; Reliability engineering; Testing; accelerated life test; ceramic to metal seal; hermeticity; implantable electrical feedthrough; reliability demonstration testings;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2012 IEEE International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4577-1678-2
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2012.6241837