• DocumentCode
    2634482
  • Title

    Product reliability at low failure rates: Wrong expectations and real limitations

  • Author

    Kanert, Werner

  • Author_Institution
    IFAG ATV QM QE, Infineon Technol., Neubiberg, Germany
  • fYear
    2012
  • fDate
    15-19 April 2012
  • Abstract
    The automotive industry serves as a prominent example for high reliability requirements under harsh application conditions. Reliability assessment is torn between expectations from customers and what it can realistically achieve, reliability testing being limited by both technical and economical reasons. Furthermore, reliability methodology on package and product level severely lags behind what we have become accustomed to on the wafer technology side. The paper looks at some of the issues and implications when assessment of low failure rates is required.
  • Keywords
    automotive components; automotive electronics; failure analysis; semiconductor device reliability; automotive industry; low failure rate assessment; product reliability; reliability assessment; wafer technology; Acceleration; Failure analysis; Life estimation; Qualifications; Semiconductor device reliability; Stress; Reliability; automotive; failure rate; qualification;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2012 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4577-1678-2
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2012.6241851
  • Filename
    6241851