DocumentCode :
2634518
Title :
Glitch-Aware Pattern Generation and Optimization Framework for Power-Safe Scan Test
Author :
Devanathan, V.R. ; Ravikumar, C.P. ; Kamakoti, V.
Author_Institution :
ASIC, Texas Instruments India Pvt. Ltd., Bangalore
fYear :
2007
fDate :
6-10 May 2007
Firstpage :
167
Lastpage :
172
Abstract :
Excessive dynamic voltage drop in the power supply rails during test mode is known to result in false failures and impact yield when testing devices that use low-cost wire-bond packages. Identifying and debugging such test failures is a complex and effort-intensive process, especially when scan compression is involved. From a design cycle-tune view point, it is best to avoid this problem by generating "power-safe" scan patterns. The generation of power-safe patterns must take into consideration the DFT architecture, physical design, tuning and power constraints. In this paper, the authors propose such a framework and show experimental results on some benchmark circuits. The framework can address a non-uniform power grid and region-based power constraints. The authors show that glitching activity on nodes must be considered in order to correctly handle constraints on instantaneous peak power. The framework includes a power profiler that can analyze a pattern source for violations and a PODEM-based pattern generation engine for generating power-safe patterns.
Keywords :
automatic test pattern generation; design for testability; lead bonding; ATPG; automatic test pattern generation; design for testability; glitch power; impact yield; scan compression; wire-bond packages; Circuit optimization; Debugging; Design for testability; Packaging; Power generation; Power supplies; Rails; Test pattern generators; Testing; Voltage; Glitch Power; IR Drop; Low Power ATPG; Peak Power; Power-profiling.;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Test Symposium, 2007. 25th IEEE
Conference_Location :
Berkeley, CA
ISSN :
1093-0167
Print_ISBN :
0-7695-2812-0
Type :
conf
DOI :
10.1109/VTS.2007.34
Filename :
4209907
Link To Document :
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