DocumentCode :
2634917
Title :
Resistance drift in phase change memory
Author :
Li, Jing ; Luan, Binquan ; Lam, Chung
Author_Institution :
T.J. Watson Res., IBM, Yorktown Height, NY, USA
fYear :
2012
fDate :
15-19 April 2012
Abstract :
This paper discusses the major reliability issue in MLC PCM, namely time dependent resistance drift in amorphous chalcogenide materials. Starting from experimental observations, this paper presents a complete physical picture for structural relaxation (SR), which is considered to be the underlying mechanism for resistance drift. In particularly, various physics models and quantum molecular dynamics simulation are presented to reveal the interrelationship between atomic structure and electrical properties of amorphous chalcogenide materials. The paper provides insights to develop mitigation techniques including material engineering and various design techniques, etc. to ensure reliable MLC operations.
Keywords :
circuit reliability; molecular dynamics method; phase change memories; MLC PCM; SR; amorphous chalcogenide material; atomic structure; material engineering; mitigation technique; phase change memory; physics model; quantum molecular dynamic simulation; reliability issue; structural relaxation; time dependent resistance drift; Annealing; Kinetic theory; Phase change materials; Resistance; Strontium; Temperature measurement; drift; multi-level cell; phase change memory; structural relaxation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2012 IEEE International
Conference_Location :
Anaheim, CA
ISSN :
1541-7026
Print_ISBN :
978-1-4577-1678-2
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2012.6241871
Filename :
6241871
Link To Document :
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