• DocumentCode
    2634917
  • Title

    Resistance drift in phase change memory

  • Author

    Li, Jing ; Luan, Binquan ; Lam, Chung

  • Author_Institution
    T.J. Watson Res., IBM, Yorktown Height, NY, USA
  • fYear
    2012
  • fDate
    15-19 April 2012
  • Abstract
    This paper discusses the major reliability issue in MLC PCM, namely time dependent resistance drift in amorphous chalcogenide materials. Starting from experimental observations, this paper presents a complete physical picture for structural relaxation (SR), which is considered to be the underlying mechanism for resistance drift. In particularly, various physics models and quantum molecular dynamics simulation are presented to reveal the interrelationship between atomic structure and electrical properties of amorphous chalcogenide materials. The paper provides insights to develop mitigation techniques including material engineering and various design techniques, etc. to ensure reliable MLC operations.
  • Keywords
    circuit reliability; molecular dynamics method; phase change memories; MLC PCM; SR; amorphous chalcogenide material; atomic structure; material engineering; mitigation technique; phase change memory; physics model; quantum molecular dynamic simulation; reliability issue; structural relaxation; time dependent resistance drift; Annealing; Kinetic theory; Phase change materials; Resistance; Strontium; Temperature measurement; drift; multi-level cell; phase change memory; structural relaxation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2012 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4577-1678-2
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2012.6241871
  • Filename
    6241871