DocumentCode :
2634976
Title :
The effect of voltage bias stress on temperature-dependent conduction properties of low-k dielectrics
Author :
Atkin, J.M. ; Shaw, T.M. ; Liniger, E. ; Laibowitz, R.B. ; Heinz, T.F.
Author_Institution :
Depts. of Phys. & Electr. Eng., Columbia Univ., New York, NY, USA
fYear :
2012
fDate :
15-19 April 2012
Abstract :
The change in leakage current in porous low-k interconnect dielectrics (LKDs) arising from time-dependent dielectric breakdown (TDDB) has been investigated. Using periodic measurements of temperature-dependent IV curves and photocurrent decay during voltage bias stress the apparent change in trap density and conduction mechanism in LKDs are investigated. A substantial change in the temperature-dependence of the current is observed, suggesting a move from a thermally excited conduction process to a tunnel-like or percolative process. This change is correlated with a large increase in trap density after long-term bias stress, consistent with a trap to trap tunneling interpretation. However, throughout the high-voltage bias stress, the leakage current continues to obey a √E field dependence.
Keywords :
electric breakdown; integrated circuit interconnections; low-k dielectric thin films; porous materials; temperature measurement; TDDB; high-voltage bias stress; leakage current; long-term bias stress; percolative process; photocurrent decay; porous LKD; porous low-k interconnect dielectrics; temperature-dependent IV curve periodic measurements; temperature-dependent conduction properties; thermally excited conduction process; time-dependent dielectric breakdown; trap density; trap tunneling interpretation; tunnel-like process; voltage bias stress; voltage bias stress effect; Current measurement; Dielectrics; Electron traps; Leakage current; Photoconductivity; Stress; Temperature measurement; breakdown; low-k; reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2012 IEEE International
Conference_Location :
Anaheim, CA
ISSN :
1541-7026
Print_ISBN :
978-1-4577-1678-2
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2012.6241875
Filename :
6241875
Link To Document :
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